Micro-laser uses
Laser Processes
- Micro-drilling
- Precision micro-cutting
- Surface micro-structuring
- Ablation of thin film
- Micro-engraving
- Micro-milling
- Scribing
- Dicing
- Laser Marking
Technical Specifications
- Hole size: down to 1 μm (0.001 mm)
- Cutting/engraving width: down to 5 μm (0.005 mm)
- Accuracy and repeatability: down to 1 μm (0.001 mm)
- Aspect-ratio (thickness/lateral dimension): up to 50:1
- Thickness: up to 2 mm
Materials
- Metals, alloys and superalloys (steel, tungsten, brass, copper, aluminium, gold, silver, inconel, hastelloy, haynes, nickel, titanium, nitinol, molybdenum, tantalum, others)
- Polymers (kapton, teflon, PC, PET, PVC, PMMA, PES; PEEK, FR4, others)
- Ceramics (alumina, silicon carbide, silicon nitride, lithium niobate, zirconia, others)
- Dielectrics (glass, pyrex, fused silica, quartz, sapphire, others)
- Semiconductors (silicon, germanium, gallium arsenide, gallium nitride, others)
- Carbon Composites
Applications
- Micro-fluidics
- Precision micro-holes for micro-filters, micro-valves, nebulizers, injectors, nozzles, other
- Micro-channels for micro-fluidic devices
- Precision micro-holes for leak detection testing and flow control
- Calibrated orifices for validation of inspection machines for vials, cartridges, syringes, carpoules and ampoules.
- Micro-electronics and Photonics
- Micro-machining of substrates such as silicon, glass, polymers, ceramics and composites
- Micro-channels in polymers, glass and silicon (MEMS technology)
- Selective removal of thin film
- Calibrated orifices and slits for optical apertures
- Micro-holes and micro-cuts for flexible circuits manufacture
- Micro-mechanics
- Micro-structures for high specifications components
- Micro-texturing for tribological surfaces (i.e. engine components)
- Micro-milling for micro-molds
Sectors
- Automotive
- Aerospace
- Precision engineering
- Energy
- Medical
- Biotechnology
- Other
